Lead penetrating clamping system

ABSTRACT

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The apparatus and method contemplates the replacement of the penetrating fixed clamp with another, or second, penetrating independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

This is a contunuation of application Ser. No. 08/631,143 filed Jun. 17,1996, now U.S. Pat. No. 5,673,845.

RELATED APPLICATIONS

This application is related to Ser. No. 08/597,616, filed Feb. 6, 1996,entitled "BONDHEAD LEAD CLAMP APPARATUS AND METHOD" and assigned toMicron Technology, Inc. and is also related to Ser. No. 08/592,058,filed Jan. 26, 1996, entitled "LEADFINGER CLAMP ASSEMBLY AND METHOD OFSTABILIZING LEAD FRAME ELEMENTS" and assigned to Micron Technology, Inc.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to forming wire bonds between thecontact pads on semiconductor devices and individual lead frame fingersof a lead frame.

More specifically, the present invention is related to the apparatus andmethod of forming improved wire bonds between the contact pads onsemiconductor devices and individual lead fingers of a lead frame usingone or more independently actuated lead penetrating bond head leadclamps or a fixed bond head clamp which may be either penetrating or notduring the wire bonding process.

2. State of the Art

Well known types of semiconductor chip devices are connected to acomponent known as lead frames are subsequently encapsulated in plasticfor use in a wide variety of applications. The lead frame is typicallyformed from a single continuous sheet of metal, typically by metalstamping operations. The lead frame includes an outer supporting frameand, may include a central semiconductor chip supporting pad and aplurality of lead fingers, each lead finger having, in turn, a terminalbonding portion near the central chip supporting pad. Ultimately, theouter supporting frame of the lead frame is removed after the wire bondsbetween the contact pads of the semiconductor chip device and the leadfingers have been made and after the encapsulation of the semiconductorchip and portion of the lead fingers.

Since the lead frames are formed continuously using stamping operations,they are typically continuously rolled on a suitable reel and providedfor use. Such reeling operations of the lead frames cause the leadframes to have induced stresses and deformations therein leading to leadframes exhibiting longitudinal curvature and transverse curvature aswell as deformation of the individual leads of the lead frame. Such leadframe curvature and any attendant deformation of the leads and leadframe cause problems in the formation of reliable wire bonds with thecontact pads of semiconductor devices and the individual lead fingers ofthe lead frame. Particularly, problems arise when the size of thesemiconductor is decreased, the number of contacts pads on thesemiconductor device is increased, and the number of lead fingers on thelead frame is increased. In order to form the desired connectionsbetween the bond pads of a semiconductor device and a lead frame duringthe wire bonding process, the lead fingers of the lead frame must beimmobilized in a known, predetermined location with respect to thesemiconductor device.

Typical apparatus and methods for forming the wire bonds between thecontact pads on semiconductor devices and the lead fingers of leadframes are illustrated in U.S. Pat. Nos. 4,361,261, 4,527,730,4,600,138, 4,653,681, 4,765,531, and 5,465,899. However, such apparatusand methods do not address the problem of deformed lead frames and theireffect on the wire bonds.

Typically, the deformation of the lead frames and its effect on thequality of wire bonds have been dealt with through the use of clamps onportions of the lead frames during the wire bonding operation. In U.S.Pat. No. 4,434,347 a circular fixed clamp is used to retain the leadfingers of the lead frame during the wire bonding operation. A springloaded electrode is used to heat the end of the lead finger to helpimprove bonding of the wire.

In U.S. Pat. No. 5,322,207 a fixed clamp is used to retain the leadframe during the automated wire bonding process for connecting the bondpads of a semiconductor device to lead fingers of a lead frame.

In U.S. Pat. No. 5,307,978 a fixed clamp is illustrated for use in anapparatus and method for orienting bonding sites of a lead frame at abonding station of an automatic wire bonder.

In U.S. Pat. No. 5,035,034 a hold-down clamp having a multi-fingeredinterchangeable insert for wire bonding semiconductor lead frames isillustrated. The circular clamp insert 21 includes a plurality ofindividual fingers 22 used to bias a lead finger of a lead frame in thewire bonding process to provide a better wire bond by attempting toimmobilize the lead frame during bonding operations.

In U.S. Pat. No. 3,685,137 jaws 26 and 28 of a lead frame clamp are usedto force the lead fingers of a lead frame into a fixed position duringthe wire bonding process.

In U.S. Pat. No. 4,821,945 a method find apparatus for the single leadautomated clamping and bonding of lead fingers of lead frames areillustrated. However, such apparatus and method are used to replace thefixed clamp during such wire bonding. Additionally, the individual clampis concentrically located with respect to the wire bonding apparatus andmust rotate therearound during wire bonding operations.

While such prior art apparatus and methods have been directed inattempting to solve the problems of forming reliable wire bonds betweenthe contact pads of semiconductor devices and lead fingers of leadframes, they have not been as successful because none of the prior artclamps effectively immobilizes a lead finger during wire bondingoperations as the clamps merely engage the surface of a lead finger, ifproperly positioned thereon.

The present invention is directed to an improved wire bonding apparatusand method for forming wire bonds between semiconductor devices and leadframes by immobilizing the lead finger during the wire bonding process.

SUMMARY OF THE INVENTION

The present invention is related to the apparatus and method of formingimproved wire bonds between the contact pads on semiconductor devicesand individual lead frame fingers of a lead frame. In one instance, thepresent invention includes the use of a penetrating individualindependent lead finger clamp during the wire bonding process to provideincreased stability of the individual lead finger for improved bondingby the clamp penetrating a portion of the lead finger being bonded. Inanother instance, the present invention also provides for the use of aeither a penetrating or non-penetrating fixed clamp for the lead fingersduring the wire bonding process in addition to the penetratingindividual independent lead finger clamp during the wire bonding processto provide increased stability of the individual lead finger forimproved bonding. The present invention also contemplates thereplacement of the penetrating fixed clamp with another, or second,penetrating independent clamp in addition to the first individualindependent lead finger clamp during the wire bonding process. With theimproved clamping of the lead finger by the clamp penetrating a portionof the lead finger the present invention allows improved wire bondimpressions and improved bond strength.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be better understood when the description ofthe invention is taken in conjunction with the drawings wherein:

FIG. 1 is a perspective view of an independent individual clamp and afixed clamp used in a wire bonding process.

FIG. 1A is a perspective view of a penetrating independent individualclamp and a fixed clamp of the present invention.

FIG. 2 is a perspective view of a lead-over-chip semiconductor devicehaving the bond pads thereof connected to the lead fingers of a leadframe using penetrating independent individual clamps of the presentinvention.

FIG. 3 is a side view of the individual independent clamps used in thewire bonding of a semiconductor chip arrangement.

FIG. 3A is a side view of penetrating individual independent clamps ofthe present invention used in the wire bonding of a semiconductor chiparrangement.

FIG. 4 is a perspective view of a second alternative type of individualindependent lead clamp used in the wire bonding of a lead of a leadframe of the present invention.

FIG. 4A is a cross-sectional view of a penetrating individualindependent clamp of the type illustrated in drawing FIG. 4 of thepresent invention.

FIG. 4B are cross-sectional views of penetrating individual independentclamps of the type illustrated in drawing FIG. 4 of the presentinvention.

FIG. 5 is a perspective view of a third alternative type of independentindividual lead clamp used in the wire bonding of a lead of a lead frameof the present invention.

FIG. 5A is a front view of the penetrating independent individual leadclamp shown in FIG. 5 of the present invention.

FIG. 5B is a side view of the penetrating independent individual leadclamp shown in FIG. 5 of the present invention.

FIG. 5C is a front view of the another type of penetrating independentindividual lead clamp shown in FIG. 5 of the present invention.

FIG. 5D is a side view of the penetrating independent individual leadclamp shown in FIG. 5 of the present invention.

FIG. 6 is a perspective view of the use of two independent individuallead clamps used in the wire bonding of a lead of a lead frame of thepresent invention.

FIG. 6A is a cross-sectional view of penetrating independent individuallead clamps of the present invention as shown in FIG. 6 of the presentinvention.

FIG. 6B is a front view of one of the penetrating independent individuallead clamps as shown in FIG. 6A of the present invention.

FIG. 6C is a front view of the other penetrating independent individuallead clamps as shown in FIG. 6A of the present invention.

FIG. 7 is a perspective view of another penetrating independentindividual lead clamp used in the wire bonding of a lead of a lead frameof the present invention.

FIG. 7A is a side view of the penetrating independent individual leadclamp of FIG. 7 of the present invention.

FIG. 8 is a side view of the penetrating independent individual leadclamp of the present invention.

DESCRIPTION OF THE INVENTION

Referring to drawing FIG. 1, a semiconductor device (chip or die) 10 isshown being supported by the paddle 12 of a lead frame. A heat block 20is used to heat the paddle 12, die 10, and lead fingers 14 during thewire bonding process. As shown, a suitable wire 16 has one end thereof17 bonded to a bond pad of the die 10. The wire 16 may be of anysuitable type for connection and bonding purposes, such as gold, goldalloy, aluminum, aluminum alloy, etc. The other end 18 of the wire 16 isshown being bonded to the end 15 of a lead finger 14 of the lead frameby a suitable bonding apparatus 26. The bonding apparatus 26 may be ofany suitable type well known in the bonding area, such as a taillessthermosonic or ultrasonic capillary type bonding apparatus whichdispenses wire during the bonding process. As previously stated, thelead finger 14 is in contact with the heat block 20 to heat the leadfinger 14 to a suitable temperature for the bonding operation to helpinsure a satisfactory wire bond. If desired, in the wire bondingoperation, further shown in contact with lead finger 14 is a portion ofa conventional clamp 22 used to clamp portions of the lead frame duringsuch bonding operations. The clamp 22 may be of any well known suitabletype, such as those described hereinbefore, and is generic in shape.During the wire bonding process it is desirable for the heat block to beheated to substantially 230 degrees Centigrade. Although the heat blockmay be any suitable temperature during the bonding operation, the heatblock 20 temperature should not exceed 300 degrees Centigrade to preventthermal damage to the die 10. It is further preferred that the bond ofthe end 18 of the wire 16 made to the end 15 of the lead finger 14 bemade at a temperature of substantially 190 degrees Centigrade forbonding effectiveness. It is also preferred that the bonding apparatustypically exert a bonding force of substantially 50 to 100 grams whenbonding the end 18 of the wire 16 to the end 15 of lead finger 14 foreffective bond formation of the wire 16 to lead finger 14.

The independent clamp 24 (FIG. 1A) may be of any suitable shape for usein independently clamping the lead finger 14, in place of the use ofconventional fixed clamp 22, such as square, semicircular, rectangular,arcuate, etc. Also, as shown, the independent clamp 24 may beresiliently mounted through the use of a shoulder 50 thereon abutting aspring 52 to control the amount of the force exerted on any lead finger14 during the wire bonding operation. If desired, the independent clamp24 may include insulation or cushioning 25 on the end thereof. Theindependent clamp 24 is actuated independently of bonding apparatus 26and has the capability of independent movement along the x-axis, y-axisand z-axis with respect to the bonding apparatus 26. The independentclamp 24 is also free to move about the bonding apparatus 26 and thecentral axis of the die 10 so that any lead finger 14 that is to beconnected to a bond pad on the die 10, regardless of location, may beaccommodated. The independent clamp 24 does not need to be, andpreferably is not, concentrically centered about the bonding apparatus26 so that it will not interfere with the operation thereof. Any desirednumber of independent clamps 24 may be used about the bonding apparatusto minimize the amount of movement of the independent clamp 24 betweenwire bonding operations. The lead finger 14 may be located in quadrantsabout the die 10, or in any manner as desired.

Referring to drawing FIG. 1A, a semiconductor device (chip or die) 10 isshown being supported by the paddle 12 of a lead frame in the manner asdescribed in drawing FIG. 1 hereinbefore. Further shown in drawing FIG.1A is an independently actuated lead clamp of the present inventionhaving a lead finger penetrating portion 25 on the bottom thereof usedin place of or in addition to the conventional (fixed) clamp 22 tomaintain the lead finger 14 in position during the bonding process. Theindependent clamp 24 helps insure that the lead finger 14 is in contactwith the heat block 20 during the bonding process, immobilizes the leadfinger 14 during the wire bonding process, and helps minimize anydeflection of the end 15 of the lead finger 14 so that the bondingapparatus 26 accurately, precisely contacts the end 15 to provide thedesired wire bond. The action of independent clamp 24, and, if desiredthe additional use of fixed clamp 22, provides improved clamping andimmobilization of a lead finger 14 during the wire bonding process aswell as insures that the lead finger 14 is in intimate contact with theheat block 20 for effectiveness.

During the wire bonding process it is desirable for the heat block to beheated as described hereinbefore. Similarly, the bonding apparatusshould exert substantially the same amount of force as describedhereinbefore.

The independent clamp 24 (FIG. 1A) may be of any suitable overallexterior shape for use in independently clamping the lead finger 14, inplace of the use of conventional fixed clamp 22, such as square,semicircular, rectangular, arcuate, etc. Also, as shown, the independentclamp 24 may be resiliently mounted through the use of a shoulder 50thereon abutting a spring 52 to control the amount of the force exertedon any lead finger 14 during the wire bonding operation. The independentclamp 24 is actuated independently of bonding apparatus 26 and has thecapability of independent movement along the x-axis, y-axis and z-axiswith respect to the bonding apparatus 26. The independent clamp 24 isalso free to move about the bonding apparatus 26 and the central axis ofthe die 10 so that any lead finger 14 that is to be connected to a bondpad on the die 10, regardless of location, may be accommodated. Theindependent clamp 24 does not need to be, and preferably is not,concentrically centered about the bonding apparatus 26 so that it willnot interfere with the operation thereof. Any desired number ofindependent clamps 24 may be used about the bonding apparatus tominimize the amount of movement of the independent clamp 24 between wirebonding operations. The independent clamps 24 may be located inquadrants about the die 10, or in any manner as desired.

Referring to drawing FIG. 2, a lead-over-chip configuration using thepresent invention is shown. The lead fingers 14 are located over thechip or die 10 for wire bonding thereto. In such a configuration, thelead fingers 14 are secured to the die 10 by insulating adhesive strips30. During the bond operation, one or more of the independent clamps 24having a lead finger penetrating portion 25 located on the end thereofclamps the end 15 of lead finger 14 prior to the bonding of a wire 16thereto by one or more of the bonding apparatus 26. The independentclamp 24 applies sufficient pressure to the end 15 of the lead finger 14to compress the insulating adhesive strips 30 to insure a satisfactorybond between the end of any wire 16 and the end 15 of the lead finger14.

Referring to drawing FIG. 3, a chip or die 10 is shown having aplurality of wires 16 bonded thereto. As shown, one or more of fixedclamps 22 contacts the end 15 of lead finger 14 aft of the area of thebond of the wire end 18 to the lead finger 14. The bonds of the wire end18 to the end 15 of the lead finger 14 are typically a wedge type wirebond, although a ball bond may be made if desired. As shown, the heatblock 20 is in contact with the paddle 12 of the lead frame and the leadfingers 14.

Referring to drawing FIG. 3A, a chip or die 10 is shown having aplurality of wires 16 bonded thereto using the present invention. Asshown, one or more of the independent clamps 24 having penetratingportions 25 located thereon contacts and penetrates the end 15 of leadfinger 14 aft of the area of the bond of the wire end 18 to the leadfinger 14. As also shown, the fixed clamps 22 are formed to havepenetrating portions 22' thereon which penetrate the end 15 of leadfinger 14. In this manner, the end 15 of the lead finger 14 providesimproved clamping and immobilization of a lead finger 14 during the wirebonding process as well as insures that the lead finger 14 is inintimate contact with the heat block 20 for effectiveness. The bonds ofthe wire end 18 to the end 15 of the lead finger 14 are typically awedge type wire bond, although a ball bond may be made if desired. Asshown, the clamps 22 and 24 having lead finger penetrating portionsthereon which cause the lead finger 14 to engage heat block 20 as wellas heat block 20 being in contact with the paddle 12 of the lead frame.However, care should be taken to prevent the lead penetrating portion 25of the clamp 24 from either damaging the lead finger 14, affecting itselectrical characteristics, or severing the lead finger 14.

Referring to drawing FIG. 4, a portion of a lead finger 14 is shown inconjunction with a bonding apparatus 26 and modified independentpenetrating lead clamp 22". The independent lead clamp 22" is for medhaving a modified end or foot 23 thereon to provide a larger clampingarea of the clamp 22" on the end 15 of the lead finger 14 during bondingoperations. The modified end or foot 23 is substantially the same widthas the lead finger 14 and may be mounted to have articulated movementabout the end of the independent clamp 22", such as using a pinextending through suitable apertures in a pair of ears 27 attached tothe foot 23 and the end of the modified independent clamp 22" forillustration purposes. Located on the bottom of the modified end or foot23 of the clamp 22" are suitable lead finger 14 penetrating members (notshown) which penetrate the lead finger 14 to immobilized it during wirebonding operations as described hereinbefore.

Referring to drawing FIG. 4A, the lead finger penetrating portion 23" ofthe foot 23 is shown in relation to the bonding apparatus 26 and leadfinger 14. The lead penetrating portion 23" partially penetrates thelead finger 14 to immobilize the end 15 thereof during wire bondingoperations by the bonding apparatus 26. The lead penetrating portion 23"may penetrate the lead finger 14 to any desired depth depending upon thethickness thereof. However, care should be taken to prevent the leadpenetrating portion 23" from either damaging the lead finger 14,affecting its electrical characteristics, or severing the lead finger14.

Referring to drawing FIG. 4B, various embodiments of the leadpenetrating portion 23" of foot 23 are shown. As shown the penetratingportion 23" may comprise a plurality of round shaped members located toeither extend along the axis of a lead finger 14 or extend transverselythereof or may comprise a knife edge shape extending transversely acrossthe axis of a lead finger 14. The shapes are to be merely illustrativeof a variety of shapes for the penetrating portion 23" which may beused.

Referring to drawing FIG. 5, an independent clamp 22 is shown having amodified end or foot 23' located on the end thereof. The end or foot 23'may be integrally attached to the clamp 22 or may have an articulatedmounting arrangement, such as shown in drawing FIG. 4. In this instance,the modified end or foot 23' is generally semicircular, or arcuate, inconfiguration so as to engage a large a portion of the end 15 of thelead finger 14 surrounding the bonding apparatus 26 during the wirebonding operation to hold the end 15 in position.

Referring to drawing FIGS. 5A through 5D, the foot 23' is shown havingvarious lead penetrating portions 23'" thereon. As illustrated, thevarious lead penetrating portions 23'" include either a knife edgeshape, as illustrated in drawing FIGS. 5A and 5B, or a blunted edge(rounded edge) shape, as illustrated in drawing FIGS. 5C and 5D. Suchshapes of the penetrating portion 23'" are to be considered merely asillustrations as other shapes for the penetrating portions may be used.As previously described, the lead penetrating portion 23'" may penetratethe lead finger 14 to any desired depth depending upon the thicknessthereof. However, care should be taken to prevent the lead penetratingportion 23'" from either damaging the lead finger 14, affecting itselectrical characteristics, or severing the lead finger 14.

Referring to drawing FIG. 6, the independent clamp 24 is shown inrelation to the bonding apparatus 26 on the end 15 of a lead finger 14as well as further being shown in relation to a second independentlyactuated clamp 50 located thereon during wire bonding operations, bothclamps 24 and 50 having portions on the bottom thereof (not shown) forpenetrating the lead finger 14 to immobilize the same during wirebonding operations. The second independently actuated clamp 50 may be ofany suitable type and structure such as described and illustratedhereinbefore. The clamp 24 and second clamp 50 be may actuatedindependently of each other and independently of the bonding apparatus26 as described and illustrated hereinbefore. Also shown is a soft metalcoating 14' located on the lead finger 14 which is penetrated by eitherthe clamp 24 or the second clamp 50. The soft metal coating 14' appliedto the lead finger 14 may be of any suitable type, such as gold, silver,aluminum, etc., which will allow for the easy penetration of the coating14' by a portion of either the clamp 24 or the second clamp 50.

Referring to drawing FIG. 6A, the independent clamp 24 is shown having alead penetrating portion 24' on the end thereof and clamp 50 is shownhaving a lead penetrating portion 50' on the end thereof penetrating thesoft metal coating 14' on the lead finger 14, both portions 24' and 50'penetrating either the lead finger 14 or the soft metal coating 14' onthe lead finger 14 being wire bonded by bonding apparatus 26. Aspreviously described, the lead penetrating portions 24' and 50' maypenetrate the lead finger 14 or any soft metal coating thereon to anydesired depth depending upon the thickness thereof. However, care shouldbe taken to prevent the lead penetrating portions 24' and 50' fromeither damaging the lead finger 14, affecting its electricalcharacteristics, or severing the lead finger 14.

Referring to drawing FIG. 6B, the clamp 24 is illustrated having a knifeedge type penetrating portion 24' thereon which extends transverselyacross the axis of a lead finger 14 (not shown). It should be understoodthat any suitable shape penetrating portion 24' may be used on clamp 24.

Referring to drawing FIG. 6C, the clamp 50 is illustrated having a knifeedge type penetrating portion 50' thereon which extends transverselyacross the axis of a lead finger 14 (not shown). It should be understoodthat any suitable shape penetrating portion 50' may be used on clamp 50.

Referring to drawing FIG. 7, a portion of a lead finger 14 isillustrated in relation to a bonding apparatus 26 and independentindividual clamp 100 having a penetrating point 100' thereon. The clamp100 is generally circular in shape having a frusto-conical penetratingpoint 100' thereon for penetrating a lead finger 14.

Referring to drawing FIG. 7A, the clamp 100 having penetrating point100" thereon and the bonding apparatus 26 are shown is cross-section inrelation to the penetrating and clamping of a lead finger 14 during wirebonding thereof. The penetrating point 100' penetrates the lead finger14 to immobilize the lead finger 14 during the wire bonding operation.As previously stated, care should be taken to prevent the leadpenetrating portion 100' from either damaging the lead finger 14,affecting its electrical characteristics, or severing the lead finger14.

Referring to drawing FIG. 8, a bonding apparatus 26 is illustrated inrelation to a lead finger 14 with the penetrating independent individualclamp 100 having a penetrating point 100' thereon. As illustrated, theclamp 100 is acting on the opposite side of the lead finger 14 from thebonding apparatus 26. It should be understood that any of thepenetrating clamps hereinbefore described may act on the opposite sideof the lead clamp 26 during the wire bonding operations regarding a leadfinger 14. It is not necessary that the penetrating clamp be position edon the same side of the lead finger 14 as the bonding apparatus 26. Asstated previously, care should be taken to prevent the lead penetratingportion 100', or the penetrating portion of any penetrating clamphereinbefore described, from either damaging the lead finger 14,affecting its electrical characteristics, or severing the lead finger14.

METHOD OF BONDING

Referring to drawing FIGS. 1 through 3, in the method of the presentinvention, a chip or die 10 is positioned within the bonding area of thebonding apparatus 26. If desired for use in addition to a penetratingindividual independent clamp 24, a conventional or penetrating clamp 22serves to help straighten the lead frame and position the lead fingers14 during subsequent bonding operations. Next, the chip or die 10 andthe lead finger 14 are heated to the desired temperature before bondingoperations by the heat block 20. At this time, the penetratingindividual independent clamp 24 is engaged, moved to the appropriatelead finger 14 which is to have a wire bonded thereto, and actuated toclamp and immobilize the end 15 of the lead finger 14 against the heatblock 20 or the adhesive strip 30. The wire bonding apparatus 26 is thenactuated to form a wire bond on end 17 of wire 16 to an appropriate bondpad on chip or die 10. After the formation of the bond of end 17 of wire16 to the bond pad of die 10, the bonding apparatus is moved toappropriate end 15 of lead finger 14 for the formation of a suitablewire bond thereto by end 18 of wire 16. After the formation of the bondof the end 18 of wire 16 to the end 15 of lead finger 14, thepenetrating individual independent clamp 24 and the bonding apparatusare actuated to remove the clamp 24 and the bonding apparatus 26 fromthe end 15 of the lead finger 14. Alternately, the bonding apparatus 26is actuated to remove the apparatus from the bond location at the end 15of the lead finger 14 prior to or after the removal of the penetratingindividual independent clamp 24 from a lead finger 14. During theremoval of the bonding apparatus 26 from the end 15 of the lead finger14 the conventional or penetrating clamp 22, if in contact with the end15 of a lead finger 14, supplies the necessary force to retain thefinger 14 in position relative to other lead fingers located around chipor die 10, both bonded and unbonded. As previously stated, it is notnecessary for the penetrating individual independent clamp 24 to remainin contact with the end 15 of lead finger 14 during the removal of thebonding apparatus 26 therefrom. After the wire 16 has been bonded to thedesired bond pad of die 10 and end 15 of lead finger 14, the process isrepeated until all desired wire bonds between lead fingers 14 and bondpads of chip or die 10 are completed.

If desired to have additional clamping of the lead finger 14, either afixed conventional or penetrating clamp 22 and/or a second penetratingindividual independent clamp 24 may be used with the bonding apparatus26. The second penetrating individual independent clamp 24 may beactuated and moved from the lead finger 14 with, before or after theremoval of the bonding apparatus 26 from the lead finger 14.

It will be understood that the present invention may have changes,additions, deletions, modifications, and sequence of operation whichfall within the scope of the invention. For instance, the fixed clampmay be eliminated and a second independent clamp used in its place.

What is claimed is:
 1. In a method of bonding a wire to a bond pad of asemiconductor chip and lead finger of a lead frame, said methodcomprising the steps of:engaging at least a portion of a penetratingportion of a penetrating clamp with a portion of said lead finger toretain said lead finger in position for the bonding of said wirethereto.
 2. The method of claim 1, further comprising the stepof:providing a bonding apparatus to bond said wire to said lead finger.3. The method of claim 2, further comprising the step of:actuating thebonding appartus to bond said wire to said lead finger.
 4. The method ofclaim 3, further comprising the step of:removing the at least a portionof the penetrating portion of the penetrating clamp from engagement withsaid portion of said lead finger before the removal of the bondingapparatus from the lead finger.
 5. The method of claim 1, wherein thepenetrating clamp is resiliently mounted.
 6. The method of claim 1,wherein the penetrating clamp is movable in the x-axis direction, they-axis direction, and the z-axis direction.
 7. The method of claim 2,wherein the penetrating clamp is located on one portion of said leadfinger and the bonding apparatus is located on another portion of saidlead finger.
 8. In a method of bonding a wire to a bond pad of asemiconductor chip and lead finger of a lead frame, said methodcomprising the steps of:engaging at least a portion of a first clampover a portion of said lead finger to retain said lead finger inposition for the bonding of said wire thereto; and engaging at least aportion of a penetrating clamp over another portion of said lead fingerto retain said lead finger in position for the bonding of said wirethereto.
 9. The method of claim 8, further comprising the stepof:providing a bonding apparatus to bond said wire to said lead finger.10. The method of claim 9, further comprising the step of:actuating thebonding apparatus to bond said wire to said lead finger.
 11. The methodof claim 10, further comprising the step of:removing the at least aportion of the penetrating clamp from engagement with the portion ofsaid lead finger before the removal of the bonding apparatus from thelead finger.
 12. The method of claim 8, wherein the penetrating clamp isresiliently mounted.
 13. The method of claim 8, wherein the penetratingclamp is movable in the x-axis direction, the y-axis direction, and thez-axis direction.
 14. The method of claim 8, wherein the penetratingclamp is located on a portion of said lead finger and the bondingapparatus is located on another portion of said lead finger.